Semiconductor device and light-emitting apparatus
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Jul 28, 2016
filing date -
Jul 30, 2015
priority date (Note) -
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Abstract
A semiconductor device wherein the horizontal spreading of solder at the time of reflow is suppressed and a plurality of devices can be mounted close to each other on a substrate, and a light-emitting apparatus using such a semiconductor device as a light-emitting device are provided. A semiconductor device bonded to a substrate by solder includes a semiconductor layer, a plurality of device electrodes formed on a bottom surface of the semiconductor layer, and a plurality of auxiliary electrodes formed integrally with the device electrodes, respectively, wherein each of the auxiliary electrodes includes a groove portion formed in a bottom surface thereof, and a side face of the groove portion is slanted with respect to the bottom surface of the semiconductor layer so that the groove portion becomes narrower in width with increasing distance from a lower end of the auxiliary electrode and decreasing distance to an upper end thereof.
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