Light emitting device package having LED disposed in lead frame cavities

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United States of America Patent

PATENT NO 9882104
SERIAL NO

14155519

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Abstract

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Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; a third lead frame spaced apart from the second lead frame in the second cavity; a first light emitting device on the first and second lead frames in the first cavity; a second light emitting device on the second and third lead frames in the second cavity; and a molding member in the first and second cavities.

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Patent Owner(s)

Patent OwnerAddress
SUZHOU LEKIN SEMICONDUCTOR CO LTD168 CHANGSHENG NORTH ROAD TAICANG CITY SUZHOU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Buem Yeon Seoul, KR 4 37

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