Ultra high voltage semiconductor device with electrostatic discharge capabilities

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United States of America Patent

PATENT NO 9882046
SERIAL NO

15094605

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Abstract

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A method includes forming a drain region in a first layer on a semiconductor substrate. The drain region is formed comprising a drain rectangular portion having a first end and a second end, a first drain end portion contiguous with the drain rectangular portion and extending from the first end of the drain rectangular portion away from a center of the drain region, and a second drain end portion contiguous with the drain rectangular portion and extending from the second end of the drain rectangular portion away from the center of the drain region. The method also comprises forming a source region free from contact with and surrounding the drain region in the first layer. The first drain end portion and the second drain end portion are formed having a same doping type and a different doping concentration than the drain rectangular portion.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Po-Tao Taipei, TW 46 242
Huang, Kun-Ming Taipei, TW 51 168
Shen, Chih-Heng Hsinchu County, TW 32 223
Wang, Shen-Ping Keelung, TW 31 108
Yang, Chun-Yi Hsinchu, TW 28 82
Yang, Tsai-Feng Hualien County, TW 5 9

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