Method for forming a nanowire structure

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United States of America Patent

PATENT NO 9882026
SERIAL NO

14993935

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Abstract

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Embodiments of the invention describe a method for forming a nanowire structure on a substrate. According to one embodiment, the method includes a) depositing a first semiconductor layer on the substrate, b) etching the first semiconductor layer to form a patterned first semiconductor layer, c) forming a dielectric layer across the patterned first semiconductor layer, and d) depositing a second semiconductor layer on the patterned first semiconductor layer and on the dielectric layer. The method further includes e) repeating a)-d) at least once, f) following e), repeating a)-c) once, g) etching the patterned first semiconductor layers, the dielectric layers, and the second semiconductor layers to form a fin structure, and h) removing the patterned first semiconductor layers from the fin structure.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Genji Kai, JP 29 857
Tapily, Kandabara N Albany, US 50 1436

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