Sidewall spacers for self-aligned contacts
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2018
Issued Date -
N/A
app pub date -
Feb 29, 2016
filing date -
Feb 29, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device and method for fabricating such a device are presented. The semiconductor device includes a first gate electrode of a transistor, a first sidewall spacer along a sidewall of the gate pattern, a first insulating layer in contact with the first sidewall spacer and having a planarized top surface, and a second sidewall spacer formed on the planarized top surface of the first insulating layer. The second sidewall spacer may be formed over the first sidewall spacer. A width of the second sidewall spacer is equal to or greater than a width of the first sidewall spacer.
First Claim
all claims..Other Claims data not available
Family
- No Family data available.
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD | 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78 |
International Classification(s)

- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Hua Feng | Hsinchu, TW | 34 | 177 |
# of filed Patents : 34 Total Citations : 177 | |||
Hsieh, Min-Yann | Hsinchu, TW | 28 | 122 |
# of filed Patents : 28 Total Citations : 122 | |||
Lin, Jyun-Ming | Hsinchu, TW | 15 | 163 |
# of filed Patents : 15 Total Citations : 163 | |||
Pan, Kuo-Hua | Hsinchu, TW | 125 | 373 |
# of filed Patents : 125 Total Citations : 373 | |||
Wu, C H | Hsinchu, TW | 4 | 56 |
# of filed Patents : 4 Total Citations : 56 |
Cited Art Landscape
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Patent Citation Ranking
- 14 Citation Count
- H01L Class
- 87.83 % this patent is cited more than
- 7 Age
Forward Cite Landscape
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 30, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 30, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jul 14, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Jan 30, 2018 | I | Issuance | |
Jan 10, 2018 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Aug 31, 2017 | P | Published | |
Mar 04, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, JYUN-MING;CHEN, HUA FENG;PAN, KUO-HUA;AND OTHERS;REEL/FRAME:038723/0970 Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TAIW Effective Date: Mar 04, 2016 |
Feb 29, 2016 | F | Filing |

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