Handle for semiconductor-on-diamond wafers and method of manufacture

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United States of America Patent

PATENT NO 9882007
SERIAL NO

14409867

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Abstract

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Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.

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Patent Owner(s)

Patent OwnerAddress
RFHIC CORPORATIONRFHIC BLDG 110 GWACHEON-DAERO 12-GIL GWACHEON-SI 13824

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Diduck, Quentin Santa Clara, US 17 108
Ejeckham, Felix Santa Clara, US 2 10
Francis, Daniel Santa Clara, US 61 2022
Lowe, Frank Yantis Santa Clara, US 10 27

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