Array of memory cells and methods of forming an array of memory cells
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
May 20, 2016
filing date -
May 20, 2016
priority date (Note) -
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Abstract
A method of forming an array of memory cells comprises forming an elevationally inner tier of memory cells comprising spaced inner tier lower first conductive lines, spaced inner tier upper second conductive lines, and programmable material of individual inner tier memory cells elevationally between the inner tier first lines and the inner tier second lines where such cross. First insulative material is formed laterally between the inner tier second lines to have respective elevationally outermost surfaces that are lower than elevationally outermost surfaces of immediately laterally-adjacent of the inner tier second lines. Second insulative material is formed elevationally over the first insulative material and laterally between the inner tier second lines. The second insulative material is of different composition from that of the first insulative material. An elevationally outer tier of memory cells is formed to comprise spaced outer tier lower first conductive lines, spaced outer tier upper second conductive lines, and programmable material of individual outer tier memory cells elevationally between the outer tier first lines and the outer tier second lines where such cross. Arrays of memory cells independent of method of manufacture are disclosed.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MICRON TECHNOLOGY INC | 8000 SOUTH FEDERAL WAY BOISE ID 83716-9632 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Allen,, III Tuman Earl | Kuna, US | 9 | 60 |
Frost, Denzil S | Boise, US | 7 | 23 |
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