Semiconductor apparatus, solid state imaging device, imaging apparatus and electronic equipment, and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2018
Issued Date -
N/A
app pub date -
Nov 27, 2014
filing date -
Dec 10, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present technology relates to a semiconductor apparatus, a solid state imaging device, an imaging apparatus and electronic equipment which realize a smaller and thinner size and which enable improvement of optical characteristics, and a manufacturing method thereof. A side electrode 16c is formed on a side face of a substrate on which an imaging device 16 is formed. By this side electrode 16c being connected to an electrode pad 15b on the substrate 15 through a chip wiring 17 formed with solder, the imaging device 16 is electrically connected to the substrate 15. By this means, because it is possible to electrically connect the imaging device 16 to the substrate 15 without using wire bonding, space required for wire bonding is not required, so that it is possible to realize a smaller and thinner apparatus. The present technology can be applied to an imaging apparatus.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully