Electronic device and method for fabricating the same
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Jul 11, 2016
filing date -
Dec 30, 2015
priority date (Note) -
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Abstract
Provided is an electronic device including a semiconductor memory. The semiconductor memory may include: a substrate; and a stepped structure including first interlayer dielectric layers and conductive layers which are alternately stacked over the substrate, wherein ends of the conductive layers are exposed along the profile of the stepped structure, and the stepped structure further includes a barrier layer formed on a sidewall of the conductive layer.
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