Fabricating a dual gate stack of a CMOS structure

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United States of America Patent

PATENT NO 9881921
SERIAL NO

15483286

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Abstract

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A dual gate CMOS structure including a semiconductor substrate; a first channel structure including a first semiconductor material and a second channel structure including a second semiconductor material on the substrate. The first semiconductor material including SixGe1-x where x=0 to 1 and the second semiconductor material including a group III-V compound material. A first gate stack on the first channel structure includes: a first native oxide layer as an interface control layer, the first native oxide layer comprising an oxide of the first semiconductor material; a first high-k dielectric layer; a first metal gate layer. A second gate stack on the second channel structure includes a second high-k dielectric layer; a second metal gate layer. The interface between the second channel structure and the second high-k dielectric layer is free of any native oxides of the second semiconductor material.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Czornomaz, Lukas Zurich, CH 60 513
Deshpande, Veeresh Vidyadhar Zurich, CH 11 20
Djara, Vladimir Kilchberg, CH 16 62
Fompeyrine, Jean Waedenswil, CH 53 536

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