Apparatuses and methods for forming die stacks
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Apr 18, 2017
filing date -
Dec 11, 2015
priority date (Note) -
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Abstract
Apparatuses and methods for forming die stacks are disclosed herein. An example method includes dispensing a temporary adhesive onto a substrate, placing a base die onto the temporary adhesive, curing the temporary adhesive, forming a die stack that includes the base die, activating a release layer disposed on the substrate, wherein the release layer is between the substrate and the temporary adhesive, removing the die stack from the substrate, and removing the temporary adhesive from the die stack.
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