Method for attaching a semiconductor die to a carrier
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Oct 29, 2015
filing date -
Oct 31, 2014
priority date (Note) -
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Abstract
A method for fabricating an electronic device includes providing a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first semiconductor die and a first solder interconnect layer applied to a main face of the first semiconductor die. The second semiconductor chip has a second semiconductor die, an insulating layer applied to a main face of the second semiconductor die, and a second solder interconnect layer applied to the insulating layer. The method further includes attaching the first semiconductor chip with the first solder interconnect layer to a first carrier and attaching the second semiconductor chip with the second solder interconnect layer to a second carrier.
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