Integrated fan-out package on package structure and methods of forming same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9881908
SERIAL NO

14996494

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Abstract

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An embodiment package includes a first package; a thermal interface material (TIM) contacting a top surface of the first package, and a second package bonded to the first package. The second package includes a first semiconductor die, and the TIM contacts a bottom surface of the first semiconductor die. The package further includes a heat spreader disposed on an opposing surface of the second package as the first package.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Cheng-Lin Hsin-Chu, TW 119 1373
Jeng, Shin-Puu Hsin-Chu, TW 851 18082
Leu, Shyue-Ter Hsin-Chu, TW 27 59
Lin, Po-Yao Zhudong Township, TW 271 1156
Lin, Wen-Yi New Taipei, TW 81 1412
Liu, Hsien-Wen Hsin-Chu, TW 181 861

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