Semiconductor package, semiconductor device using the same and manufacturing method thereof
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United States of America Patent
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Jan 30, 2018
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app pub date -
May 24, 2016
filing date -
Aug 5, 2015
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Abstract
A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.
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