Semiconductor module, bonding jig, and manufacturing method of semiconductor module

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United States of America Patent

PATENT NO 9881890
SERIAL NO

15284714

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Abstract

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A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.

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Patent Owner(s)

Patent OwnerAddress
OLYMPUS CORPORATION2951 ISHIKAWA-MACHI HACHIOJI-SHI TOKYO 192-8507

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kojima, Kazuaki Suwa, JP 25 725

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