Metal routing architecture for integrated circuits

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United States of America Patent

PATENT NO 9881885
SERIAL NO

14954116

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Abstract

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A device includes a substrate, a metal pad over the substrate, and a metal trace electrically disconnected from the metal pad. The metal pad and the metal trace are level with each other. A passivation layer includes a portion overlapping an edge portion of the metal pad. A metal pillar is overlying the metal pad, and is electrically connected to the metal pad. The metal trace has a portion overlapped by the metal pillar.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chen-Shien Hsin-Chu, TW 407 8285
Chen, Chih-Hua Hsin-Chu, TW 138 2193
Chuang, Chita Hsin-Chu, TW 53 571
Chuang, Yao-Chun Hsin-Chu, TW 94 790
Kuo, Chen-Cheng Hsin-Chu, TW 104 2218

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