Semiconductor device and method of producing semiconductor device

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United States of America Patent

PATENT NO 9881878
SERIAL NO

15274787

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Abstract

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A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

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Patent Owner(s)

Patent OwnerAddress
SOCIONEXT INCKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Awaya, Tomoharu Kawasaki, JP 16 177
Banno, Koji Kawasaki, JP 15 160
Minami, Takayoshi Kawasaki, JP 14 256
Takeda, Shigetoshi Kawasaki, JP 12 136
Ushida, Fumio Kawasaki, JP 8 65
Yamada, Tomoyuki Kawasaki, JP 94 439

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