Electronic circuit package using composite magnetic sealing material
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Nov 16, 2016
filing date -
Mar 31, 2016
priority date (Note) -
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Abstract
Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
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