Semiconductor device having conductive shield layer
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Jul 29, 2016
filing date -
Jul 31, 2015
priority date (Note) -
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Abstract
A semiconductor device includes a wiring substrate that includes a base having a first surface, a second surface, and a wiring, a semiconductor chip located on the first surface, an external connection terminal located on the second surface and electrically connected to the wiring, a sealing resin layer covering the semiconductor chip, a metal compound layer containing a metal nitride in contact with a surface of the sealing resin layer, and a conductive shield layer covering the sealing resin layer with the metal compound layer interposed between the conductive shield layer and the sealing resin layer. The wiring is exposed at a side surface of the wiring substrate, and is electrically connected to the conductive shield layer.
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