Electronic module and method of making the same
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United States of America Patent
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Jan 30, 2018
Grant Date -
Feb 5, 2015
app pub date -
Jul 16, 2014
filing date -
Jul 31, 2013
priority date (Note) -
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Abstract
A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.
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