Forming method of superposition checking mark, manufacturing method of a semiconductor device and semiconductor device
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Mar 1, 2016
filing date -
Dec 1, 2015
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Abstract
According to one embodiment, a forming method of superposition checking marks includes forming a first superposition checking mark to have a first step with respect to an arrangement surface for the first superposition checking mark, forming an opaque film having a second step resulting from the first step on the arrangement surface, and forming on the opaque film a second superposition checking mark provided with a transparent film allowing observation of the second step.
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