Method for fabricating a local interconnect in a semiconductor device

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United States of America Patent

PATENT NO 9881872
SERIAL NO

14996811

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Abstract

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A semiconductor device includes a first transistor having a first gate, a first source and a first drain, a second transistor having a second gate, a second source and a second drain, an isolation region separating the first transistor from the second transistor, and a local interconnect connecting at least one of the first source and the first drain to at least the second source and the second drain. The local interconnect is in contact with a surface of the at least one of the first source and the first drain, a surface of the at least the second source and the second drain and a surface of a part of the isolation region.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ying-Yan Hsinchu, TW 13 85
Lai, Jui-Yao Changhwa, TW 21 496
Yeong, Sai-Hooi Zhubei, TW 508 1349

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