Substrate block for PoP package
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
May 9, 2014
filing date -
May 9, 2014
priority date (Note) -
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Abstract
A substrate block is provided that has an increased width. The substrate block comprises two substrate bars, and the substrate bars each comprise a substrate and a plurality of filled vias through the substrate. The substrate block may be used to manufacture package substrates, and these package substrate may be incorporated into a PoP structure. The package substrate includes a carrier having a plurality of vertical interconnections and a bar coupled to the vertical interconnections.
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