Solder bond site including an opening with discontinuous profile

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United States of America Patent

PATENT NO 9881858
SERIAL NO

14798261

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Abstract

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Apparatuses and methods for formation of a bond site including an opening with a discontinuous profile are disclosed herein. An example apparatus may at least include a substrate, a contact on the substrate, and a mask layer formed on the substrate and at least a portion of the contact. The mask layer may also include an opening formed therein, with the opening having a discontinuous profile from a top surface of the mask layer to the contact.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT633 WEST FIFTH STREET 24TH FLOOR LOS ANGELES CA 90071

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arnold, Dale Meridian, US 5 18
Gandhi, Jaspreet Milpitas, US 5 128

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