Pad design for reliability enhancement in packages
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Feb 4, 2015
filing date -
Jun 12, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A package includes a corner, a device die having a front side and a backside, and a molding material molding the device die therein. A plurality of redistribution lines is on the backside of the device die. The plurality of redistribution lines includes a plurality of metal pads. A polymer layer contacts the plurality of metal pads. A plurality of openings is formed in the polymer layer, with the plurality of metal pads aligned to and exposed to the plurality of openings. The plurality of openings includes a corner opening that is elongated and an additional opening farther away from the corner than the corner opening. The additional opening is non-elongated.
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