Semiconductor device and method for producing semiconductor device
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Mar 4, 2016
filing date -
May 29, 2015
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Abstract
A semiconductor device includes a semiconductor substrate, a device layer located at an upper surface of the semiconductor substrate, an insulating layer located on the device layer, and a through electrode. The through electrode includes a body located in a through hole provided in the insulating layer and a head located on the body and the insulating layer and is electrically connected to an upper-layer wiring in the device layer. A perimeter of the head on a lower surface side thereof is smaller than a perimeter of the head on an upper surface side thereof.
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