Package structures and method of forming the same
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Sep 18, 2015
filing date -
Sep 18, 2015
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Abstract
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
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