Method of forming an integrated circuit with heat-mitigating diamond-filled channels
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United States of America Patent
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Jan 30, 2018
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app pub date -
Jan 5, 2017
filing date -
Dec 9, 2015
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Abstract
An integrated circuit and method of forming the integrated circuit, including the steps of forming channels partially into a thickness of a semiconductor layer or through the thickness of the semiconductor layer and partially through a thickness of a substrate layer on which the semiconductor layer was formed. The method may then include underfilling or overfilling the channels with diamond. If underfilled, a remainder of the channels may be filled in with nucleation buffer layers or additional semiconductor material. If overfilled, the diamond may be selectively polished down to form a planar surface with the semiconductor layer. Next, the method may include forming an active device layer over the semiconductor material and diamond. The method may also include thinning the substrate layer down to the diamond and then placing a heat sink in physical contact with the diamond in the channel.
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