Thermal interface material on package
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Oct 23, 2015
filing date -
Jan 23, 2014
priority date (Note) -
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Abstract
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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