Semiconductor structure having thermal backside core
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United States of America Patent
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Jan 30, 2018
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app pub date -
Jul 27, 2016
filing date -
Feb 17, 2015
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Abstract
A semiconductor structure includes a semiconductor substrate having a recess disposed beneath a semiconductor device. The semiconductor structure also includes a thermally conductive core disposed in the recess, and a package substrate including a heat sink. The heat sink is in thermal contact with the thermally conductive core.
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