Multi-stepped boat assembly for receiving semiconductor packages
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Sep 16, 2015
filing date -
Sep 19, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-stepped boat assembly includes a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in the stack hole. A guide boat has at least one guide hole vertically aligned with the at least one stack hole. The guide boat is removably attachable to the stack boat. An inner sidewall of the stack hole includes a first step configured to receive the first semiconductor package, and a second step provided on the first step and configured to receive the second semiconductor package. The guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.
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