Mounting structure and method for producing mounting structure

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United States of America Patent

PATENT NO 9881813
SERIAL NO

15212158

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Abstract

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A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hino, Hirohisa Osaka, JP 21 49
Mori, Masato Hyogo, JP 74 375
Ohashi, Naomichi Hyogo, JP 23 85
Suzuki, Yasuhiro Osaka, JP 445 4205

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