Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Nov 21, 2011
filing date -
Nov 22, 2010
priority date (Note) -
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Abstract
A polishing liquid includes abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×105 G.
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
- C09C:TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBRO....
- B24D:TOOLS FOR GRINDING, BUFFING, OR SHARPENING
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