Metal cap integration by local alloying
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2018
Issued Date -
N/A
app pub date -
Jul 20, 2016
filing date -
Jul 20, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A middle-of-line interconnect structure including copper interconnects and integral copper alloy caps provides effective electromigration resistance. A metal cap layer is deposited on the top surfaces of the interconnects. A post-deposition anneal causes formation of the copper alloy caps from the interconnects and the metal cap layer. Selective removal of unalloyed metal cap layer material provides an interconnect structure free of metal residue on the dielectric material layer separating the interconnects.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully