RFIC module and RFID tag including the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2018
Issued Date -
N/A
app pub date -
Dec 1, 2016
filing date -
Nov 27, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An RFIC chip includes a first input/output terminal and a second input/output terminal and is built into a multilayer substrate. A power feeding circuit includes coil conductors and is built into the multilayer substrate. A first coil conductor includes a first coil end connected to the first input/output terminal, and a second coil conductor includes a second coil end connected to the second input/output terminal. First and second terminal electrodes are connected to one end of the first coil conductor and one end of the second coil conductor, respectively. A first coil portion is disposed in a section extending from the first coil end to the first position and a second coil portion is disposed in a section extending from the second coil end to the second position. The RFIC chip is interposed between the first coil portion and the second coil portion in a planar view of the multilayer substrate.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H01Q Class
- 2554 Applications Filed
- 2142 Patents Issued To-Date
- 83.87 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01Q Class
- 17.89 % this patent is cited more than
- 7 Age
Maintenance Fees
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|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 30, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 30, 2029 |
