Cooling device with nested chambers for computer hardware
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United States of America Patent
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Jan 30, 2018
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app pub date -
Jun 8, 2016
filing date -
Jun 8, 2016
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Abstract
The present invention is notably directed to a cooling device, e.g., for computer hardware. The device comprises a deformable, outer chamber, having at least one thermally conducting section, the latter suited for thermally contacting a heat source of a computer hardware. The outer chamber is deformable upon a pressure increase therein. The cooling device further comprises at least one inner chamber nested in the outer chamber, the inner chamber expandable in volume upon a pressure increase therein. The invention is further directed to a computer hardware apparatus comprising such a cooling device, or stacks of such cooling devices paired with respective set of electronic components.
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