Thermal management for solid-state drive
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Jul 27, 2015
filing date -
Apr 12, 2013
priority date (Note) -
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Abstract
A device structure includes a printed circuit board (PCB) comprising a thermal conduction plane, at least one heat generating component thermally connected to the thermal conduction plane, and a first frame portion thermally connected to the thermal conduction plane and at least partially enclosing the at least one heat generating component. The thermal conduction plane thermally connects the at least one heat generating component to the first frame portion by way of a plurality of vias from a surface of the PCB to the thermal conduction plane.
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