Photo-curable and thermo-curable resin composition and dry film solder resist
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United States of America Patent
Stats
-
Jan 30, 2018
Issued Date -
N/A
app pub date -
Jul 26, 2013
filing date -
Aug 1, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.
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International Classification(s)
- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 30, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 30, 2029 |
