Semiconductor device

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United States of America Patent

PATENT NO 9880285
SERIAL NO

14538235

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Abstract

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A semiconductor device includes: a substrate; a first layer that is stacked on the substrate and includes an inductor; and a bump group that is arranged above the first layer, wherein the bump group includes a plurality of bumps that are arranged under a predetermined rule, and at least one bump that is different from the plurality of bumps and whose center does not overlap the inductor when the semiconductor device is viewed in a plan view from a direction vertical to a plane on which the bump group is provided.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATION4-1 NISHI-SHINJUKU 2-CHOME SHINJUKU-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiba, Shigeto Shiojiri, JP 4 3
Hatanaka, Koichi Matsumoto, JP 13 149
Kitazawa, Takeo Azumino, JP 9 22

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