Sensing structure of alignment of a probe for testing integrated circuits
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United States of America Patent
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Jan 30, 2018
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app pub date -
Jun 30, 2015
filing date -
Jun 10, 2010
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Abstract
A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
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