High bandwidth signal probe tip
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Feb 11, 2013
filing date -
Feb 11, 2013
priority date (Note) -
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Abstract
A high bandwidth signal probe device and a method of probing a high bandwidth signal are provided. The high bandwidth signal probe device includes a probe tip for probing a stub of a backdrilled via of a printed circuit board. The probe tip is adapted to fit in the backdrilled via. The probe tip has a length adapted to reach the stub of the backdrilled via. The probe tip is adapted to contact a plated portion of the stub of the backdrilled via. A resistive element is associated with the probe tip. The method includes inserting a probe tip of a signal probe device in the backdrilled via, placing the probe tip in contact with a plated portion of the stub of the backdrilled via, and receiving an electrical signal through a path which includes a resistive element of the probe tip of the signal probe device.
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