MEMS sensor with electronics integration

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United States of America Patent

PATENT NO 9878904
SERIAL NO

15333810

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Abstract

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A MEMS device with electronics integration places integrated circuit components on a topping wafer of a sensing die to conserve space, minimize errors and reduce cost of the device as a whole. The topping wafer is bonded to a sensing wafer and secured in a housing.

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Patent Owner(s)

Patent OwnerAddress
ROSEMOUNT AEROSPACE INC14300 JUDICIAL ROAD BURNSVILLE MN 55306-4898

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Potasek, David P Lakeville, US 33 139

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