Packaged hot-melt pressure sensitive adhesive
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2018
Grant Date -
Dec 4, 2014
app pub date -
May 29, 2014
filing date -
May 29, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Calculated Rating
|
US Family Size
|
Non-US Coverage
|
|
Patent Longevity
|
Forward Citations
|
Abstract
The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date | Type | Sub-Type |
|---|
International Classification(s)
- 2014 Application Filing Year
- C09J Class
- 1048 Applications Filed
- 793 Patents Issued To-Date
- 75.67 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 5 Citation Count
- C09J Class
- 34.56 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 30, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 30, 2029 |
