Transfer molding method, mold, and molded article

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United States of America Patent

PATENT NO 9878475
APP PUB NO 20150165660A1
SERIAL NO

14561643

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Abstract

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There is provided a molding method for efficiently and accurately molding a hollow part of a thermosetting resin with a simple mechanism, a mold, and a molded article. A mold used for molding of a thermosetting resin includes an upper mold, an intermediate mold, and a lower mold which can be stacked with each other. Primary molding for molding segment parts and secondary molding for bonding the segment parts are sequentially performed by placing or retracting the intermediate mold to switch between a runner for primary molding and a runner for secondary molding.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHATOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawamura, Shogo Kawasaki, JP 56 628

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