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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
PURDUE RESEARCH FOUNDATION	101 FOUNDRY DRIVE SUITE 2500 WEST LAFAYETTE IN 47906

International Classification(s)

• A61L:METHODS OR APPARATUS FOR STERILISING MATERIALS OR ....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Blum, Kevin	Lanesville, US	6	23
# of filed Patents : 6 Total Citations : 23
Neu, Corey Philip	West Lafayette, US	4	1
# of filed Patents : 4 Total Citations : 1
Novak, Tyler Anthony	Lafayette, US	3	1
# of filed Patents : 3 Total Citations : 1
Voytik-Harbin, Sherry L	Zionsville, US	29	852
# of filed Patents : 29 Total Citations : 852

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• 0 % this patent is cited more than
• 7 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 30, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 30, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 30, 2018	US,9878071,B2   US9878071B2	GRANTED PATENT AS SECOND PUBLICATION
April 16, 2015	US,20150105323,A1   US20150105323A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 5488380

Packaging architecture for phased arrays

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Abstract

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A dipole antenna is inserted into a waveguide to couple EM energy into and out of a waveguide. The dipole antenna is printed on a substrate of a module that contains electronic components. The substrate includes a coupled coplanar strip transmission line connecting the dipole antenna to a slotline. EM energy is electromagnetically coupled between the slotline and a microstrip transmission line. The EM energy is provided to and from the hermetically sealed electronic components by the microstrip transmission line.

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Description

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Claims

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Legal Events

 

• FPAY2007
• FPAY2003
• FPAY1999
• FEPP1998
• I1996
• STCF1996
• AS1995
• F1993
• PD1991

Date	Code	Event	Description
Jul 30, 2007	FPAY	FEE PAYMENT	year of fee payment: 12
Jul 30, 2003	FPAY	FEE PAYMENT	year of fee payment: 8
Jul 30, 1999	FPAY	FEE PAYMENT	year of fee payment: 4
Dec 03, 1998	FEPP	FEE PAYMENT PROCEDURE	free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Jan 30, 1996	I	Issuance
Jan 19, 1996	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Mar 27, 1995	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HARVEY, DONN T.;FITZSIMMONS, GEORGE W.;REEL/FRAME:007427/0317 Owner name: BOEING COMPANY, THE, WASHINGTON Effective Date: Mar 27, 1995
Sep 20, 1993	F	Filing
May 24, 1991	PD	Priority Date