Lead solder joint structure and manufacturing method thereof

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United States of America Patent

PATENT NO 9877399
SERIAL NO

15259226

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Abstract

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[Problem] Even if heat cycles are applied, degradation of joint strength is restrained.

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Patent Owner(s)

Patent OwnerAddress
NEC SPACE TECHNOLOGIES LTD10 NISSIN-CHO 1-CHOME FUCHU-SHI TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ogawa, Bunsuke Tokyo, JP 1 3

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