Laminated electronic component and laminated electronic component mounting structure
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United States of America Patent
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Jan 23, 2018
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app pub date -
Dec 24, 2014
filing date -
Dec 24, 2013
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Abstract
A laminated electronic component includes a main body composed of a stacked body in which dielectric layers and internal electrode layers are alternately laminated, and an external electrode disposed on an outer surface of the stacked body so as to make electrical connection with the internal electrode layers; and a first joining member and a second joining member which are provided on a first face side located in a stacking direction of the dielectric layers and the inner electrode layers. The first joining member and the second joining member are provided on a first side and second side which constitute the first face, respectively, and located in a region which includes midpoints thereof but does not include a vertex of the main body. By mounting such a laminated electronic component to a substrate via the joining members, acoustic noise can be suppressed.
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