Wiring board and mounting structure using same
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Mar 26, 2014
filing date -
Mar 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.
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