Method for packaging organic light-emitting diode apparatus, organic light-emitting diode packaging apparatus and display device

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United States of America Patent

PATENT NO 9876195
SERIAL NO

15259428

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Abstract

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The present disclosure provides a method of packaging an OLED apparatus, an OLED packaging apparatus and a display device, and relates to the field of the OLED. The method includes steps: forming a first inorganic thin film layer on an OLED to be packaged; forming a groove on a surface of the first inorganic thin film layer; forming a second organic thin film layer within the groove; and forming a third inorganic thin film layer covering the first inorganic thin film layer and the second organic thin film layer.

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Patent Owner(s)

  • BOE TECHNOLOGY GROUP CO., LTD.;ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Xu Beijing, CN 406 3483
Cui, Fuyi Beijing, CN 24 22
Sun, Quanqin Beijing, CN 12 10

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