Semiconductor light emitting device package and light source module using same
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United States of America Patent
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Jan 23, 2018
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app pub date -
Apr 20, 2016
filing date -
Aug 28, 2015
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Abstract
A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.
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